Semiconductors
The market for edge AI silicon is shifting toward agentic and multimodal capabilities, necessitating new interconnect and memory architectures like LPDDR6 to break inference bottlenecks.
Semiconductors
The semiconductor industry is grappling with process control challenges as specialty devices like MEMS and Co-Packaged Optics enter high-volume production. Mid-infrared ellipsometry is emerging as a transformative tool for metrology in these advanced structures.
Semiconductors
The chip industry faces a daunting road to 2nm nodes and beyond, as traditional scaling hits physical limits and cost-prohibitive manufacturing barriers.
Semiconductors
The push for high-performance AI chips is hitting a thermal wall. 3D packaging, while increasing density, creates massive heat bottlenecks that require revolutionary cooling and material solutions to overcome.
Semiconductors
Researchers have published new findings on natural-language chip design and rad-hard NAND, highlighting the growing intersection of AI and semiconductor architecture. These developments are critical for the next generation of localized AI compute.
Semiconductors
Researchers are uncovering new ways to engineer transistors using ultrathin Tellurium to manage noise and improve performance in next-generation chips.
Semiconductors
High-NA EUV lithography and 3D packaging are taking center stage as the industry grapples with HBM4 standards and the physical limitations of silicon. New research explores tellurium transistors and gravity-induced warpage.